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MC74HCT374A Octal 3-State Noninverting D Flip-Flop with LSTTL-Compatible Inputs
High-Performance Silicon-Gate CMOS
The MC74HCT374A may be used as a level converter for interfacing TTL or NMOS outputs to High-Speed CMOS inputs. The HCT374A is identical in pinout to the LS374. Data meeting the setup and hold time is clocked to the outputs with the rising edge of Clock. The Output Enable does not affect the state of the flip-flops, but when Output Enable is high, the outputs are forced to the high-impedance state. Thus, data may be stored even when the outputs are not enabled. The HCT374A is identical in function to the HCT574A, which has the input pins on the opposite side of the package from the output pins. This device is similar in function to the HCT534A, which has inverting outputs.
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20 PDIP-20 N SUFFIX CASE 738
1
MC74HCT374AN AWLYYWW 1 20
20
20 1
SOIC WIDE-20 DW SUFFIX CASE 751D 1 TSSOP-20 DT SUFFIX CASE 948G
HCT374A AWLYYWW 20 HCT 374A ALYW 1
* * * * * * * *
Output Drive Capability: 15 LSTTL Loads TTL/NMOS-Compatible Input Levels Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 4.5 to 5.5 V Low Input Current: 1.0 A In Compliance with the Requirements Defined by JEDEC Standard No. 7A Chip Complexity: 276 FETs or 69 Equivalent Gates Improvements over HCT374 -- Improved Propagation Delays -- 50% Lower Quiescent Power -- Improved Input Noise and Latchup Immunity
20 1
A WL YY WW
= Assembly Location = Wafer Lot = Year = Work Week
ORDERING INFORMATION
Device MC74HCT374AN MC74HCT374ADW Package PDIP-20 SOIC-WIDE Shipping 1440 / Box 38 / Rail 1000 / Reel 75 / Rail 2500 / Reel
MC74HCT374ADWR2 SOIC-WIDE MC74HCT374ADT MC74HCT374ADTR2 TSSOP-20 TSSOP-20
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 8
Publication Order Number: MC74HCT374A/D
MC74HCT374A
PIN ASSIGNMENT
OUTPUT ENABLE Q0 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 CLOCK
LOGIC DIAGRAM
D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 CLOCK 3 4 7 8 13 14 17 18 11 2 5 6 9 12 15 16 19 Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 NONINVERTING OUTPUTS
D0 D1 Q1 Q2 D2 D3 Q3 GND
FUNCTION TABLE
Inputs Output D H L X X Q H L No Change Z Output Enable L L L H
OUTPUT ENABLE
1
PIN 20 = VCC PIN 10 = GND
Clock
L,H, X
X = don't care Z = high impedance
III I I IIIIIIIIIIIIIII II III I I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II
Design Criteria Value 69 Units ea. ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product 1.5 5.0 W pJ .0075 *Equivalent to a two-input NAND gate.
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MC74HCT374A
II II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIII I II I I I II I I II I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I I I I I III I I I I I II I I I II I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I II I I I II I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I III I I I I I II I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I II I I I II I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I II I I I II I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIII I I I I IIIIIIIIIIIIIIIIIIIIIII III I II I IIIIIIIIIIIIIIIIIIIIIII II I I IIII I I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I
IIIIIIIIIIIIIIIIIIII II I IIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIII II I II I I III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I III II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
SymbolIIIIIIIIIIIIII Parameter VCC Vin DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) Value Unit - 0.5 to + 7.0III V V V - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 35 75 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature - 65 to + 150 260
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
_C _C
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC, SSOP or TSSOP Package)
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter Min 4.5 0 Max 5.5 Unit V V
DC Supply Voltage (Referenced to GND)
Vin, Vout TA
DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)
VCC
- 55 0
+ 125 500
_C
ns
tr, tf
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol VIH VIL
Parameter
Test Conditions
VCC V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5 4.5 5.5 5.5
- 55 to 25_C 2.0 2.0 0.8 0.8 4.4 5.4
v 85_C v 125_C
2.0 2.0 0.8 0.8 4.4 5.4 2.0 2.0 0.8 0.8 4.4 5.4 3.7 0.1 0.1 0.4
Unit V V V
Minimum High-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v v
Maximum Low-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
VOH
Minimum High-Level Output Voltage
Vin = VIH or VIL |Iout| 20 A
v v v v
Vin = VIH or VIL |Iout| 6.0 mA Vin = VIH or VIL |Iout| 20 A Vin = VIH or VIL |Iout| 6.0 mA
3.98 0.1 0.1
3.84 0.1 0.1
VOL
Maximum Low-Level Output Voltage
V
0.26
0.33
Iin
Maximum Input Leakage Current Maximum Three-State Leakage Current
Vin = VCC or GND
0.1 0.5
1.0 5.0
1.0 10
A A
IOZ
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0 A
ICC
Maximum Quiescent Supply Current (per Package)
5.5
4.0
40
160
A
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MC74HCT374A
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I III I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I
ICC Additional Quiescent Supply Current Vin = 2.4 V, Any One Input Vin = VCC or GND, Other In uts Inputs lout = 0 A -55_C 2.9 25_C to 125_C 2.4 5.5 mA NOTE: 1. Total Supply Current = ICC + ICC. NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIII IIII III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIII IIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII I
Guaranteed Limit Symbol fmax Parameter - 55 to 25_C 30 31 30 30 12 10 15
AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V 10%, CL = 50 pF, Input tr = tf = 6.0 ns)
v 85_C
24 39 38 38 15 10 15
v 125_C
20 47 45 45 18 10 15
Unit
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 4) Maximum Propagation Delay, Clock to Q (Figures 1 and 4)
MHz ns ns ns ns
tPLH, tPHL tPLZ, tPHZ tPZL, tPZH
Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Output Enable to Q (Figures 2 and 5) Maximum Output Transition Time, Any Output (Figures 1 and 4) Maximum Input Capacitance
tTLH, tTHL Cin
pF pF
Cout
Maximum Three-State Output Capacitance (Output in High-Impedance State)
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V 65
CPD
Power Dissipation Capacitance (Per Flip-Flop)*
pF
* Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (VCC = 5.0 V 10%, Input tr = tf = 6.0 ns)
II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I I I IIII IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I IIII IIII I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I
Guaranteed Limit Symbol tsu th Parameter - 55 to 25_C 12
v 85_C
15 5.0 15
v 125_C
18 5.0 18
Unit ns ns ns ns
Minimum Setup Time, Data to Clock (Figure 3) Minimum Hold Time, Clock to Data (Figure 3) Minimum Pulse Width, Clock (Figure 1)
5.0 12
tw
tr, tf
Maximum Input Rise and Fall Times (Figure 1)
500
500
500
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MC74HCT374A
SWITCHING WAVEFORMS
tr CLOCK 2.7 V 1.3 V 0.3 V tw 1/fmax tPLH Q 90% 1.3 V 10% tTLH tTHL tPHL Q 1.3 V tf VCC GND Q 1.3 V 10% tPZH tPHZ 90% VOH HIGH IMPEDANCE OUTPUT ENABLE 1.3 V GND tPZL tPLZ HIGH IMPEDANCE VOL 3V
Figure 1.
Figure 2.
VALID DATA 3V 1.3 V tsu CLOCK GND th 3V 1.3 V GND
Figure 3.
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL CONNECT TO GND WHEN TESTING tPHZ AND tPZH
CL*
CL*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 4.
Figure 5.
EXPANDED LOGIC DIAGRAM
D0 3 D C 11 Q D1 4 D C Q D2 7 D C Q D3 8 D C Q D4 13 D C Q D5 14 D C Q D6 17 D C Q D7 18 D C Q
CLOCK
OUTPUT 1 ENABLE
2 Q0
5 Q1
6 Q2
9 Q3
12 Q4
15 Q5
16 Q6
19 Q7
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MC74HCT374A
PACKAGE DIMENSIONS
PDIP-20 N SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
11
-A-
20
B
1 10
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
SO-20 DW SUFFIX CASE 751D-05 ISSUE F
D A
11 X 45 _
q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
H
M
B
M
20
10X
0.25
E
1
10
h
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
DIM A A1 B C D E e H h L
L
18X
e
A1
q
T
C
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MC74HCT374A
PACKAGE DIMENSIONS
20X
K REF
M
TSSOP-20 DT SUFFIX CASE 948E-02 ISSUE A
TU
S
0.15 (0.006) T U
S
0.10 (0.004)
V
S
K K1
2X
L/2
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
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IIII IIII IIII
SECTION N-N M DETAIL E DETAIL E
20
11
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
DIM A B C D F G H J J1 K K1 L M
MC74HCT374A
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MC74HCT374A/D

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